A solventless compounding process and its application in the field of flexible packaging
[Abstract] a solventless compounding process and its application in the field of flexible packaging belong to the production technology of packaging materials. The solventless compounding process uses 100% solid adhesive, which is evenly coated on the surface of the material to be compounded after heating and melting. After laminating, cooling and curing, The base material is compounded by the bonding force generated by the curing of the adhesive itself. Compared with the traditional process, this process has considerable versatility in the selection of adhesives and composite substrates. It can be applied to almost all plastic films, papers and metal foils in the field of flexible packaging, and all substances before and after compounding have not undergone chemical changes. Polyurethane insulation materials actually have a low share in China's building energy-saving material market. Therefore, this process has the advantages of low investment, low energy consumption and pollution-free, Moreover, the technical properties of composites are much higher than those of traditional processes
[sovereignty] 1 A solvent-free composite process and its application in the field of flexible packaging are beneficial to improving the R & D strength of new materials when the company has too much oxide skin in aviation, aerospace, nuclear power and other fields. It is characterized in that the process uses 100% solid adhesive, which is evenly coated on the surface of the material to be composite after heating and melting. After laminating, cooling and curing, The base material is compounded by the bonding force generated by the curing of the adhesive itself
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